Technology SIP

February 29th, 2012 News

Construction Technology SIP has been calculated in detail and primarily aimed at reducing costs while maximizing comfort and quality of housing. Today, SIP offers a high-tech solution for low-rise residential and nonresidential buildings. Technology SIP – one of the most developed, it has many options for use: houses of different levels, add attic floors, renovation of old buildings, and so on … Many vendors offer SIP curved panels for curved roofs. Advances in computer aided design and manufacturing allow details of SIP panels with amazing precision, for the erection of flat, smooth, and error-free walls. Worldwide panel of SIP, currently, manufactured using different surface materials, including particle board and oriented (OSB), plywood, cement-fiber boards and metal.

SIP panels can be a thickness of 4 to 14 – inches, depending on the climatic conditions. Structural features, exceptional strength and energy-saving features make the SIP technology building blocks for the twenty-first century pre-fabricated buildings. Thermal calculation for 3-layer wall panels with facings of OSB and insulation of expanded polystyrene insulation thickness of 150 mm gives the following results: Initial data: The thickness of the OSP-12mm; The thickness of the polystyrene-150mm Calculated outdoor temperature TH-26oS Operating temperature of indoor air TVN 18 The heat transfer coefficient inside surface cladding of 8.7 W / (m2 * ) The heat transfer coefficient (for the winter conditions) the outer surface of the cladding n 23 W / (m2 * C) to 150 mm of insulation: Ro = 1 / 8, 7 +2 * 0.012 / 0.18 0.15 / 0.041 1 / 23 = 0.115 0.133 3.658 0.043 = 3.95 W / MoC is essential that Ro was greater than or equal to Rtr.


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